eeProductCenter.com: The First Stop for the Latest ICs and Components

Analog Boards / Buses DSP Electromechanical Embedded Tools Interconnects Microprocessors Memory Logic and Interfaces Passives / Sensors PLDs / FPGAs Power Components Power Sources RF / Microwave Test / Measurement

Product Shopper New Product Info

Resource Links

eeProductCenter is the product resource for electronics engineers and engineering managers seeking analog/mixed-signal products, DSPs, FPGAs/PLDs, logic/interface devices, memory components, interconnects, passives, power components/supplies, microprocessors, microcontrollers, radio frequency (RF) ICs, test equipment, and more.



Front-end module for GPS applications cuts current consumption Infineon Technologies AG's BGM781N11 GPS module boosts sensitivity to enable, for example, E911 emergency call requirements for mobile phones, personal navigation devices and other handheld systems, and GPS applications in vehicles. Read full story »		Premo and Ihman partner to integrate radio modules in active RFID Configurable, multichannel RF signal generator reduces costs Miniaturized comparators offer portable applications benefits OK Labs, Citrix aim beyond Android with Nirvana platform Power amplifier linearization SoC enables highly efficient broadband 3G and 4G networks Complete PHY and MAC card debuts for LTE or WiMAX Monopole antennas enable multiple M2M applications for Zigbee and ISM Band Preconfigured OpenVPX development systems speed design Metering chips feature isolated sensing technology


PR Newswire IBM Unveils New POWER7 Systems to Manage Increasingly Data-Intensive Services /C O R R E C T I O N -- Peratech Limited/ InFocus Cuts More Cords to Projectors, Now Also for MacBooks Chrysler Group LLC to Showcase Live, Mobile TV at Chicago Auto Show JDSU Introduces J-Complete, an Innovative Suite of Carrier Ethernet Test Applications Broadcom Introduces 65nm 3G HSPA Chipset Solution to Enable High-Speed, Low Cost Smartphone Devices OmniVision Launches Second-Generation Backside Illumination Pixel Technology Trimble Introduces Indoor Mobile Mapping Solution for Capturing Interior Spaces in 2D and 3D Visualization Models CEVA Introduces Comprehensive Partner Program Accelerating the Development of LTE, WiMAX and SDR Wireless Communications Solutions mimoOn and CEVA to Demonstrate Single-Core Real-time LTE UE Platform at Mobile World Congress